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DTSTAMP:20260423T092449Z
UID:1776936209046-87461@ical.marudot.com
DTSTART;VALUE=DATE:20261027
DTEND;VALUE=DATE:20261029
SUMMARY:Sustainable Packaging Innovation Forum 2026
URL:https://innovationforum.co.uk/conferences/sustainable-packaging/
DESCRIPTION:This is a calendar placeholder for the Sustainable Packaging Innovation Forum USA 2026. We look forward to welcoming you in Chicago on October 27-28.\n\nFor any questions\, please refer to the event website or email lia.dagiau@innovationforum.co.uk.
LOCATION:The Study at University of Chicago
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DESCRIPTION:Sustainable Packaging Innovation Forum 2026
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DESCRIPTION:Sustainable Packaging Innovation Forum 2026
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